Preparation and properties of lightweight low dielectric quartz fiber/epoxy resin composites

doi:10.19936/j.cnki.2096-8000.20260828.010

Abstract

Abstract: A lightweight and low dielectric quartz fiber/epoxy resin based composite material has been developed to meet the requirements of low thermal conductivity and low dielectric performance in the aerospace industry. The thermal behavior of the material was determined by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Its density, thermal conductivity and dielectric constant were investigated using a solid density meter, thermal conductivity tester and vector network analyzer. The results show that the amount of curing agent has a significant impact on the crosslinking reaction efficiency of epoxy resin. The crosslinking reaction efficiency is the highest and the curing exothermic enthalpy value is the best when the amount of curing agent is 45%(based on the mass of epoxy resin). When the amount of foaming agent is 5%, the density of the prepared quartz fiber/epoxy resin composite material is reduced by 27% compared with the unfrothed epoxy resin composite material, the thermal conductivity is reduced by 11%, the dielectric constant is reduced by 31%, and the dielectric loss is reduced by 48%.

Key words: quartz fiber, epoxy resin, AC foaming agent, dielectric properties, thermal conductivity

CLC Number:

TB332

GAO Chang, LUAN Yihao, SONG Li, SHAO Mingzhe, LI Jie, WANG Juntao, LU Yilin, LIU Zhanshuo. Preparation and properties of lightweight low dielectric quartz fiber/epoxy resin composites[J]. COMPOSITES SCIENCE AND ENGINEERING, 2026, 0(8): 79-87.

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