COMPOSITES SCIENCE AND ENGINEERING ›› 2025, Vol. 0 ›› Issue (8): 66-73.DOI: 10.19936/j.cnki.2096-8000.20250828.008

• BASIC AND MECHANICAL PERFORMANCE RESEARCH • Previous Articles     Next Articles

Moisture absorption behavior of epoxy resin cured products and its influence on the dielectric properties

ZHANG Dujuan, LI Yafeng, LI Songming, LU Haijun   

  1. Composite Technology Center, AVIC Beijing Aeronautical Manufacturing Technology Research Institute, Beijing 101300, China
  • Received:2024-05-17 Online:2025-08-28 Published:2025-09-23

Abstract: To investigate the moisture absorption behavior of epoxy resin and the changes in its dielectric properties post-absorption, the study developed epoxy resins with various structures by varying the type of curing agent. The moisture absorption rate of the cured materials was monitored under 70 ℃ water immersion conditions, and the dielectric properties were tracked. The results indicated that the moisture absorption process followed the Fick diffusion model, the type of curing agent affects the polarity and free volume of the cured material, the polarity determines the equilibrium moisture absorption rate of the resin, and the polarity and free volume jointly determine the diffusion coefficient of water molecules. The greater the polarity, the higher the moisture absorption rate of the resin equilibrium, and the easier it is for the polar groups to form hydrogen bonds with water molecules and hinder the movement of water molecules. The larger the free volume, the more diffusion channels the water molecule has, and the faster the diffusion. The dielectric properties of the cured matter are different with different curing agents, and the dielectric constant and loss tangent change linearly with the moisture absorption rate and are independent of the type of curing agent. Based on this research, a model was developed to predict the dielectric properties of epoxy resins as a function of their moisture absorption rates, with a deviation of no more than 10% between model predictions and actual measurements.

Key words: epoxy resin, curing agent, moisture absorption rate, dielectric constant, loss tangent, composites

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