Experimental and numerical simulation of bonding properties of NiTi-SMA wire/epoxy resin interface

doi:10.19936/j.cnki.2096-8000.20250728.002

Abstract

Abstract: Studied the influence of various factors on the interfacial bonding performance between nickel-titanium shape memory alloy (NiTi-SMA) wire/epoxy resin. Firstly, the bonding strength of the SMA wire/epoxy resin interface was determined by SMA wire pull-out tests, focusing on the effects of adhesive type, SMA wire bonding length, and prestrain level on the interfacial failure mode and bonding strength. Then, based on the cohesive zone model, numerical simulation of the interfacial mechanical behavior were conducted to further analyze the shear stress distribution during the SMA wire pull-out process. Finally, a load-slip constitutive model was established based on the experimental results. The results show that the failure modes of Sikadur-330 CN and Lica-102 are both interfacial bonding failures between SMA wire and epoxy resin, with effective bonding lengths ranging from 2.0 cm to 3.0 cm. The epoxy resin Sikadur-330 CN exhibits the best bonding performance, with a bonding strength approximately 1.20~1.42 times that of the other adhesive. The bonding strength at the prestrain level of 12% is 1.37~3.16 times that of other pre-strain levels. The established load-slip constitutive model can effectively simulate the mechanical behavior of the SMA wire/epoxy resin interface. This study provides theoretical support for the preparation and practical engineering applications of FRP/SMA composite materials.

Key words: shape memory alloys, epoxy resin, interfacial bonding strength, numerical simulation, constitutive model

CLC Number:

TB332

LU Chunling, GAN Xiao, DU Shiyuan, WANG Qiang, ZHU Wanxu. Experimental and numerical simulation of bonding properties of NiTi-SMA wire/epoxy resin interface[J]. COMPOSITES SCIENCE AND ENGINEERING, 2025, 0(7): 10-18.

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