Experimental and numerical simulation of bonding properties of NiTi-SMA wire/epoxy resin interface
LU Chunling, GAN Xiao, DU Shiyuan, WANG Qiang, ZHU Wanxu
COMPOSITES SCIENCE AND ENGINEERING . 2025, (7): 10 -18 .  DOI: 10.19936/j.cnki.2096-8000.20250728.002

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