EFFECTS OF REPAIR ANGLES ON THE TEMPERATURE AND THERMAL STRESS OF COMPOSITE PATCHES DURING CURING PROCESS

Abstract

Abstract: The physical and mathematical models of composite patches during curing process are established using finite element analysis. The temperature field and the thermal stress field of resin matrix composite patches in different repair angles are simulated during curing process. The effects of repair angles on temperature, curing degree and thermal stress of patches are studied. The results show that, the smaller the repair angles are, the larger of the temperature peak and the thermal stress at the center of patch, and the faster of the curing rate will be. At decentered point of patch, the curing rate is faster, the thermal stress is smaller for small repair angles than that for larger one, and the repair angles have important effect on the value of the thermal stress. Based on the comprehensive analysis, it can be concluded that, within the scope of the repair angles, the repair angles is smaller, the repair quality of composite patches is better. The research results provide the good numerical basis for the actual repair.

Key words: resin matrix composite, patch, repair angles, curing process, temperature field, thermal stress

CLC Number:

TB332

TANG Qing-ru, TIAN Qiu-shi, PANG Jie, CHEN Shu-xian. EFFECTS OF REPAIR ANGLES ON THE TEMPERATURE AND THERMAL STRESS OF COMPOSITE PATCHES DURING CURING PROCESS[J]. Fiber Reinforced Plastics/Composites, 2017, 0(2): 15-20.

References

[1] Yang Q, Li X D, Shi L, et al. The thermal characteristics of epoxy resin: Design and predict by using molecular simulation method[J]. Polymer, 2013, 54(23): 6447-6454.
[2] 罗立, 唐庆如. 玻璃纤维对环氧基体预浸料固化特征的影响研究[J]. 玻璃钢/复合材料, 2014(4): 13-17.
[3] Yue G Q, Zhang B M, Dai F H, et al. Three-dimensional cure simulation of stiffened thermosetting composite panels[J]. J. Mater. Sci. Technol., 2010, 26(5): 467-471.
[4] 刘国春, 杨文峰, 秦文峰, 等. 平纹编织复合材料层板维修的挖补角度优化分析与试验验证[J]. 科学技术与工程, 2015, 18(15): 147-150.
[5] 喻梅, 许希武. 复合材料挖补修理结构的压缩强度分析[J]. 中国矿业大学学报, 2008, 37(5): 709-714.
[6] ADIN H. The investigation of the effect of angle on the failure load and strength of scarf lap joints[J]. International Journal of Mechanical Sciences, 2012, 61(1): 24-31.
[7] 田秋实, 唐庆如, 王渊涛, 等. 不同降温速率条件下复合材料修补片固化温度场和热应力分析[J]. 硅酸盐通报, 2015, 34(S1): 181-185.
[8] 陈淑仙, 田鹤, 李梦, 等. 环氧树脂基预浸料热固化特征温度和固化度研究[J]. 玻璃钢/复合材料, 2015(02): 16-20.
[9] 庞小平. 铁硼基复合材料热应力的数值模拟[D]. 天津: 河北工业大学, 2008.
[10] 王志远, 陈刚, 郑志才. 树脂基复合材料固化过程温度场研究进展[J]. 工程塑料应用, 2010,8(38): 85-89.
[11] 朱伯芳. 有限单元法原理与应用[M]. 北京: 中国水利水电出版社, 1998.
[12] 崔俊芝, 梁俊. 现代有限元软件方法[M]. 北京: 国防工业出版社, 1995.
[13] 王勖成, 邵敏. 有限单元法基本原理和数值方法[M]. 北京: 清华大学出版社, 1997.
[14] 张剑, 李思简. 复合材料大层数层合板热变形热应力有限元分析[J]. 固体力学学报, 1997, 18(4): 359-364.
[15] 陈淑仙, 王渊涛, 杨文锋, 等. 树脂基复合材料修补片固化过程中的温度场[J]. 西南交通大学学报, 2014, 49(5): 869-874.