空心玻璃微珠填充环氧树脂固化动力学模型研究

doi:10.19936/j.cnki.2096-8000.20260828.009

复合材料科学与工程 ›› 2026, Vol. 0 ›› Issue (8): 70-78.DOI: 10.19936/j.cnki.2096-8000.20260828.009

空心玻璃微珠填充环氧树脂固化动力学模型研究

舒礼伟¹, 张颍², 高进城^2*, 胡雪琴³, 丁安心^3*

1.海军装备部,北京 100070;
2.武汉第二船舶设计研究所,武汉 430061;
3.武汉理工大学材料科学与工程学院,武汉 430070

收稿日期:2025-07-14 出版日期:2026-08-28 发布日期:2026-09-24
通讯作者: 高进城(1994—),男,硕士,研究方向为船体结构计算与仿真,gaojincheng94@163.com。丁安心(1987—),男,博士,教授,硕士生/博士生导师,研究方向为复合材料固化工艺方法,axding@whut.edu.cn。
作者简介:舒礼伟(1978—),男,博士,研究方向为船体结构。

Investigation on the cure kinetics model of epoxy resin filled with hollow glass microspheres

SHU Liwei¹, ZHANG Ying², GAO Jincheng^2*, HU Xueqin³, DING Anxin^3*

1. Naval Equipment Department, Beijing 100070, China;
2. Wuhan Second Ship Design and Research Institute, Wuhan 430061, China;
3. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China

Received:2025-07-14 Online:2026-08-28 Published:2026-09-24

摘要/Abstract

摘要： 围绕空心玻璃微珠填充环氧树脂体系的固化行为,系统开展了试验测试与动力学建模研究。首先通过非等温DSC试验,考察了升温速率对固化反应放热的影响。结果表明,随着升温速率的增大,反应放热峰逐渐后移,幅宽和峰值增大,反应热流增大,释放速率加快。基于n级反应和自催化动力学模型,对不同升温速率下的固化速率与转化率进行了拟合,发现自催化动力学模型拟合度高。随后选取50 ℃、70 ℃、75 ℃和90 ℃,采用等温DSC试验进一步分析不同恒温条件下的固化过程。结果表明,空心玻璃微珠填充环氧树脂体系在高温下反应速率显著提升,但难以实现100%转化率,说明存在反应受扩散控制的阶段,且低温条件下固化缓慢,固化度偏低。结合Kamal模型对等温数据进行拟合,构建了完整的等温固化动力学方程。

关键词: 空心玻璃微珠, 环氧树脂, 固化, 动力学模型

Abstract: A systematic study was conducted on the curing behavior of hollow glass microsphere-filled epoxy resin systems through experiments and kinetic modeling. Initially, non-isothermal DSC experiments were performed to investigate the influence of heating rates on curing exothermic reactions. Results demonstrate that with increasing heating rates, the exothermic peak shifts to higher temperatures, accompanied by enhanced peak width and magnitude, elevated heat flow, and accelerated reaction rates. Fitting analyses using n-order reaction and autocatalytic kinetic models reveal superior agreement of experimental data with the autocatalytic model across various heating rates. Subsequently, isothermal DSC experiments at 50 ℃, 70 ℃, 75 ℃, and 90 ℃ were conducted to analyze curing processes under constant temperatures. The results indicate significant acceleration of reaction rates at elevated temperatures in hollow glass microsphere-filled epoxy systems, though complete conversion (100%) remained unattainable due to diffusion-controlled reaction stages. Comparatively, sluggish curing kinetics and lower conversion degrees were observed at lower temperatures. By integrating Kamal model fitting with isothermal data, a comprehensive kinetic equation for isothermal curing was established.

Key words: hollow glass microspheres, epoxy resin, cure, kinetics model

中图分类号:

TB332

舒礼伟, 张颍, 高进城, 胡雪琴, 丁安心. 空心玻璃微珠填充环氧树脂固化动力学模型研究[J]. 复合材料科学与工程, 2026, 0(8): 70-78.

SHU Liwei, ZHANG Ying, GAO Jincheng, HU Xueqin, DING Anxin. Investigation on the cure kinetics model of epoxy resin filled with hollow glass microspheres[J]. COMPOSITES SCIENCE AND ENGINEERING, 2026, 0(8): 70-78.

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空心玻璃微珠填充环氧树脂固化动力学模型研究

Investigation on the cure kinetics model of epoxy resin filled with hollow glass microspheres

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