COMPOSITES SCIENCE AND ENGINEERING ›› 2015, Vol. 0 ›› Issue (11): 9-14.

• BASIC STUDY • Previous Articles     Next Articles

THREE-DIMENSIONAL NUMERICAL SIMULATION RESEARCH OF THERMAL CONDUCTIVITY OF Cu/EP COMPOSITE

LU Man1, BAO Rui1, YAN Shi-lin1*, SHAO Shi-dong2   

  1. 1. Wuhan University of Technology, Wuhan 430070, China;
    2. The Thirty-eighth Research Institute of China Electronics Technology Group Corporation, Hefei 230088, China
  • Received:2015-05-08 Online:2015-11-28 Published:2021-09-14

Abstract: Thermal conductivity of Cu/EP composite was studied by numerical simulation method. A 3D model of particles random distribution was established by ANSYS/APDL parametric finite element analysis technology. The effect of model size, volume fraction, single particle size or normal distribution particle sizes, particle shape, particle size and particles distribution on thermal conductivity of Cu/EP composites were investigated. The simulation results show that when the length of thermal conductivity model is greater than 100μm, the thermal conductivity is close to stabilization. Thermal conductivity of Cu/EP composite increases with volume fraction, and the magnitude of increase becomes bigger and bigger. Filling same particle size particles and normal distribution particle sizes particles, thermal conductivities of them keep pace with each other. Particle size has effect on thermal conductivity, and the change law is not monotonous increasing or decreasing. Cube fillers enhance the performance of thermal conductivity better than sphere fillers. The thermal conductivity will be different for different particles distribution in the matrix. When the particles are arranged along the direction of heat flow, the enhancement is significant.

Key words: copper, EP, thermal conductivity, finite element analysis

CLC Number: