COMPOSITES SCIENCE AND ENGINEERING ›› 2013, Vol. 0 ›› Issue (4): 43-50.

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RESEARCH OF EPOXY RESIN CURING KINETICS AND ITS APPLICATION

LI Heng, WANG De-hai*, QIAN Xia-qing   

  1. College of Chemical Engineering and Materials Science,Zhejiang University of Technology,Hangzhou 310014,China
  • Received:2012-09-25 Online:2013-07-28 Published:2022-03-14

Abstract: Differential scanning calorimetry(DSC) analysis including isothermal and non-isothermal method is an effective way to study epoxy resin curing kinetics. The present review intends to summarize the recent progress in the research of epoxy resin curing kinetics via DSC analysis (model fitting and model free method) . The application of epoxy resin curing kinetics in different systems is described. Finally,the paper prospects the future of kinetic studies.

Key words: epoxy resin, DSC, curing kinetics, model fitting method, model free kinetics

CLC Number: