THERMAL OXIADATIVE DEGRADATION KINETICS OF SILICON-ARYLACETYLENE-CONTAINING RESIN

Abstract

Abstract: Silicon-arylacetylene-containing resin (PSA-R) offers excellent high-temperature resistance,low dielectric constant,high-temperature mechanical property and easy processability. The kinetics of the thermal oxidative degradation of silicon-arylacetylene-containing resin was investigated by thermogravimetric analysis (TGA) under air. The thermal oxidative degradation of PSA-R had three different processes: thermal oxidation of unsaturated chain,thermal oxidative degradation of end-,side-chain scission and main-chain. The corresponding kinetic parameters include activation energy,pre-exponential factor and empirical order of the thermal oxidative degradation stages were evaluated by using Ozawa and Kissinger metnods,respectively.

Key words: silicon-containing arylacetylene resin, thermal oxidative, kinetics

CLC Number:

TB332
TQ323

CHI Tie, QI Hui-min, HUANG Fa-rong, DU Lei. THERMAL OXIADATIVE DEGRADATION KINETICS OF SILICON-ARYLACETYLENE-CONTAINING RESIN[J]. COMPOSITES SCIENCE AND ENGINEERING, 2013, 0(2): 34-38.

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