CHEMORHEOLOGICAL BEHAVIOR AND CURE KINETICS OF
 SILICONRYLACETYLENECONTAINING RESIN FOR RESIN TRANSFER MOLDING

Abstract

Abstract:

Siliconarylacetylenecontaining resin (PSAR) is applied in aerospace and electrical

industries， which is suitable for resin transfer molding with hightemperature resistant，

excellent dielectric constant， hightemperature mechanical property and processability. The cure

kinetics of PSAR resin was analyzed by using dynamic differential scanning calorimetry(DSC)， and

it was found that the cure of PSAR resin followed an nthorder reaction mechanism. The reaction

order was nearly two with activation energy of 110kJ·mol1. The chemorheological behavior of PSA

R resin was studied with parallel plate viscosity spectrometer. A rheological mode based on the dual

Arrhenius equation was estabilished and used to simulate the rheological behavior of PSAR resin.

The model prediction determined from the dualArrhenius equation was in good agreement with

experimental data.

Key words: siliconarylacetylenecontaining resin, resin transfer molding, chemorheology, cure kinetics

CLC Number:

TB332

Q.H.M W.C.L G.J.M. CHEMORHEOLOGICAL BEHAVIOR AND CURE KINETICS OF
SILICONRYLACETYLENECONTAINING RESIN FOR RESIN TRANSFER MOLDING[J]. Fiber Reinforced Plastics/Composites, 2009, 205(6): 62-65.

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