Abstract:

【Abstract】 According to the film forming property,the resin film's state(in room temperature),DSC curves and the viscosity-temperature characteristics of epoxy matrix,the resin film system which was used as moderate-temperature hot-melt prereg has been designed.The formula involves curing agent/accelerator/epoxy resin with mass porportion of 56/23/100.This system can be cured at mid-temperature.With very exlellent film forming properties,the film was prepared with good toughness at room temperature,which could meet the requirements of moderate-temperature hot-melt prepreg.

Key words:  Prepreg, Epoxy resin, Resin film, Hot-melt film method