Application of PMI foam on microstrip antenna array

doi:10.19936/j.cnki.2096-8000.20220428.014

Abstract

Abstract: In order to meet the requirement of a millimeter wave microstrip antenna with low-loss transmission, the fabrication of microstrip arry with PMI foam sandwich structure was investigated. PMI foam with rigid sealing structure is selected as the interlayer between the two layers of microstrip on the antenna array, thermoset conductive semi-solidified sheet was used as the cementing materia, and the PMI foam sandwich structure was cemented by vacuum hot-pressing process of PCB. The technology of PMI foam material selection, PMI foam fabrication and bonding of sandwich structure are discussed. According to the proposed technological approach, the sample is trial-produced, and the index test and tensile test are carried out. The test results show that the PMI sandwich structure has excellent performance and good bonding strength,which can satisfy the design of microstrip antenna array.

Key words: PMI foam, microstrip antenna, antenna array, bonding, composites

CLC Number:

TB332

LIU Xiu-li. Application of PMI foam on microstrip antenna array[J]. COMPOSITES SCIENCE AND ENGINEERING, 2022, 0(4): 87-91.

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