RESEARCH ON MANUFACTURE OF COMPOSITES BY NON-METALLICCOMPONENTS FROM WASTE PRINTED CIRCUIT BOARDS

doi:10.19936/j.cnki.2096-8000.20210628.018

Abstract

Abstract: With the development of information-based society, the number of electric product is increasing explosively, and its twice-born rate is accelerating. Therefore, a large number of electronic waste is produced. As a kind of hazardous waste, waste printed circuit boards has complex composition, and unreasonable disposal is easy to cause environmental pollution. At present, the recycling of metal components from waste printed circuit boards are developed but the treatment of non-metallic components is still in the research phase. The proportion of non-metallic component of waste printed circuit boards can reach about 70%, and it is the key point of recycling non-metallic component in waste printed circuit boards. Glass fiber and resin are the main components of non-metallic, and have high value utilization. The physical disposal methods of nonmetal are reviewed, in order to provide reference and thinking for the high value utilization of non-metal materials in waste printed circuit boards.

Key words: waste circuit board; non-metal; composites; filler; modification; resource

CLC Number:

TB332

LI Shuo, YIN Jin, GONG Jia-hao, ZHAO Lei, GAO Ting, LIU Rui-yong. RESEARCH ON MANUFACTURE OF COMPOSITES BY NON-METALLICCOMPONENTS FROM WASTE PRINTED CIRCUIT BOARDS[J]. COMPOSITES SCIENCE AND ENGINEERING, 2021, 0(6): 113-118.

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