Abstract: Bonding repair is a common kind of composite repairing method. Accurate analysis of stress of repair adhesive layer is always a difficult problem for engineers. The traditional finite element method (FEM) based on H element (less than 2 order) for composite laminate bonding repair is faced with the problem of high ratio of length to width. In order to improve the calculation accuracy, great efforts have to be spent on refining mesh. Advanced FEM using P element (up to 8 order) can achieve the element length-width ratio of more than 200∶1, which is very suitable for composite laminate bonding repair analysis. In this paper, a simplified analysis method for the laminate step-step excavation and bonding repair is used. Furthermore,based on the StressCheck software P element,the shear stress and peeling stress of the adhesive layer are analyzed. The comparison results show that the stress results of the adhesive layer based on P element are more realistic, due to the fact that it considers the additional bending moment caused by the eccentricity of each step load. This indicates that this new method can be applied to engineering analysis.

Key words: composite; bonding; step patch repair; shear stress; peel stress