复合材料科学与工程 ›› 2026, Vol. 0 ›› Issue (4): 89-100.DOI: 10.19936/j.cnki.2096-8000.20260428.011

• 基础与力学性能研究 • 上一篇    下一篇

多颗磨粒异步刻划C/SiC复合材料的三维多相有限元建模与试验研究

张广滨1, 李远辰1*, 李澳1, 郑炎钊1, 梁凯1, 郭义2   

  1. 1.天津工业大学 机械工程学院,天津 300387;
    2.天津凯华绝缘材料股份有限公司,天津 300300
  • 收稿日期:2025-02-05 发布日期:2026-06-16
  • 通讯作者: 李远辰(1988—),男,博士,讲师,主要从事硬脆材料加工方面的研究,liyuanchen@ tiangong.edu.cn。
  • 作者简介:张广滨(1999—),男,硕士研究生,主要从事C/SiC复合材料磨削加工方面的研究。

Three-dimensional multiphase finite element modelling and experimental study of C/SiC composites asynchronous scratching by multiple abrasive grains

ZHANG Guangbin1, LI Yuanchen1*, LI Ao1, ZHENG Yanzhao1, LIANG Kai1, GUO Yi2   

  1. 1. School of Mechanical Engineering, Tiangong University, Tianjin 300387, China;
    2. Tianjin Kaihua Insulation Material Co., Ltd., Tianjin 300300, China
  • Received:2025-02-05 Published:2026-06-16

摘要: 为深入揭示碳纤维增强陶瓷基复合材料(C/SiC)磨削机理,针对目前宏观单相有限元方法无法直观体现纤维和基体的失效形式、切屑类型等问题,本文综合考虑了纤维-界面-基体多相的相互作用机制,通过数值仿真建立了多颗磨粒刻划C/SiC复合材料的三维有限元模型,对磨粒轴向间距和刻划深度进行了仿真分析。通过相应的试验研究,阐明了基体和纤维的失效形式、切屑形成过程、磨粒不同轴向间距下中间区域表面损伤形貌,揭示了多颗磨粒在不同轴向间距和刻划深度下的刻划力变化规律。结果表明:磨粒的刻划力会交互影响,磨粒一刻划后在表面留下较多的损伤,有效降低了磨粒二的刻划力,且这种影响随着轴向间距的不同而表现为不同程度的干涉作用,表明磨粒之间存在较强耦合关系;当间距为70 μm时,磨粒之间干涉不明显,为临界间距。与沿着横向纤维方向刻划相比,沿着纵向纤维方向的刻划力更大,这是由于界面的剪切强度大于界面的脱黏强度,且纤维轴向强度大于径向强度导致的。

关键词: C/SiC复合材料, 多颗磨粒刻划, 有限元仿真, 刻划力, 材料去除

Abstract: In order to deeply reveal the grinding mechanism of carbon fibre reinforced ceramic matrix composites (C/SiC), for the current macroscopic single-phase finite element method can not intuitively reflect the failure form of the fibre and matrix, chip type and other problems, this paper comprehensively considered the fibre-interface-matrix interaction mechanism through the numerical simulation method, and established a three-dimensional multi-phase finite element model for multiple abrasive grains to scribe the C/SiC composites and simulation analysis on the scribing model was simulated and analysed for the axial spacing of abrasive grains and the scribing depth. Through the corresponding experimental study, the failure form of matrix and fibre, the chip formation process, the surface damage morphology of the intermediate region under different axial spacing of abrasive grains were elucidated, and the variation trend of the scribing force under different axial spacing and scribing depth of multiple abrasive grains was revealed. The results show that the scribing force of the abrasive grains interacts with each other, leaving more damage on the surface after the scribing of abrasive grain Ⅰ, effectively reducing the scribing force of abrasive grain Ⅱ, and this effect manifests itself as different degrees of interference with different axial spacings, indicating that there exists a strong coupling relationship between the abrasive grains, and the interference between the abrasive grains is insignificant when the spacing is 70 μm, which is the critical spacing. The scribing force is greater along the longitudinal fibres than the transverse fibres, which is due to the fact that the shear strength of the interface is greater than the debonding strength of the interface and the axial strength of the fibres is greater than the radial strength.

Key words: C/SiC composites, multiple abrasive grains scratching, finite element simulation, scribing force, material removal

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