复合材料科学与工程 ›› 2025, Vol. 0 ›› Issue (7): 10-18.DOI: 10.19936/j.cnki.2096-8000.20250728.002

• 基础与力学性能研究 • 上一篇    下一篇

NiTi-SMA丝/环氧树脂界面黏结性能试验与数值模拟

卢春玲1,2, 甘潇2, 杜诗远2, 王强1,2*, 朱万旭1,2   

  1. 1.广西绿色建材与建筑工业化重点实验室,桂林 541004;
    2.桂林理工大学 土木工程学院,桂林 541004
  • 收稿日期:2024-05-27 出版日期:2025-07-28 发布日期:2025-08-22
  • 通讯作者: 王强(1979—),男,博士,副教授,硕士生导师,主要从事结构加固方面的教学和研究工作,632544958@qq.com。
  • 作者简介:卢春玲(1978—),女,博士,教授,主要从事结构加固方面的教学和研究工作。
  • 基金资助:
    国家自然科学基金(52068014);广西自然科学基金(2023GXNSFAA026337)

Experimental and numerical simulation of bonding properties of NiTi-SMA wire/epoxy resin interface

LU Chunling1,2, GAN Xiao2, DU Shiyuan2, WANG Qiang1,2*, ZHU Wanxu1,2   

  1. 1. Guangxi Key Laboratory of Green Building Materials and Construction Industrialization, Guilin 541004, China;
    2. School of Civil Engineering, Guilin University of Technology, Guilin 541004, China
  • Received:2024-05-27 Online:2025-07-28 Published:2025-08-22

摘要: 研究了各因素对镍钛形状记忆合金(NiTi-SMA)丝/环氧树脂界面黏结性能的影响。首先通过SMA丝拔出试验测定SMA丝/环氧树脂界面的黏结强度,重点探究胶结剂种类、SMA丝黏结长度与预应变水平对界面破坏模式以及黏结强度的影响;然后基于内聚力模型对界面力学行为进行数值模拟,进一步分析SMA丝拔出过程的剪应力分布;最后根据试验结果建立荷载-滑移本构模型。结果表明:Sikadur-330 CN和Lica-102的破坏模式均为SMA丝/环氧树脂界面黏结破坏,且有效黏结长度处于2.0~3.0 cm之间。黏结性能最佳的是Sikadur-330 CN环氧浸渍树脂,其黏结强度约为另一胶体黏结强度的1.20~1.42倍。SMA丝预应变水平为12%时的黏结强度是其他预应变水平黏结强度的1.37~3.16倍。建立的荷载-滑移本构模型能够较好地模拟SMA丝/环氧树脂界面的力学行为。本研究可为FRP/SMA复合材料的设计制备以及实际工程应用提供一定的理论支撑。

关键词: 形状记忆合金, 环氧树脂, 界面黏结强度, 数值模拟, 本构模型

Abstract: Studied the influence of various factors on the interfacial bonding performance between nickel-titanium shape memory alloy (NiTi-SMA) wire/epoxy resin. Firstly, the bonding strength of the SMA wire/epoxy resin interface was determined by SMA wire pull-out tests, focusing on the effects of adhesive type, SMA wire bonding length, and prestrain level on the interfacial failure mode and bonding strength. Then, based on the cohesive zone model, numerical simulation of the interfacial mechanical behavior were conducted to further analyze the shear stress distribution during the SMA wire pull-out process. Finally, a load-slip constitutive model was established based on the experimental results. The results show that the failure modes of Sikadur-330 CN and Lica-102 are both interfacial bonding failures between SMA wire and epoxy resin, with effective bonding lengths ranging from 2.0 cm to 3.0 cm. The epoxy resin Sikadur-330 CN exhibits the best bonding performance, with a bonding strength approximately 1.20~1.42 times that of the other adhesive. The bonding strength at the prestrain level of 12% is 1.37~3.16 times that of other pre-strain levels. The established load-slip constitutive model can effectively simulate the mechanical behavior of the SMA wire/epoxy resin interface. This study provides theoretical support for the preparation and practical engineering applications of FRP/SMA composite materials.

Key words: shape memory alloys, epoxy resin, interfacial bonding strength, numerical simulation, constitutive model

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