Study on thermal expansion behavior and pressure balance of soft mode during soft-die forming process
MA Tengfei, GUO Zimin, LI Guiyang, ZHENG Guodong, Li Weiming
COMPOSITES SCIENCE AND ENGINEERING . 2024, (5): 107 -113 .  DOI: 10.19936/j.cnki.2096-8000.20240528.015

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