MOLECULAR SIMULATION AND EXPERIMENTAL ANALYSIS ON ELASTIC MODULUS OF EPOXY RESIN AT HIGH-LOW TEMPERATURE

Abstract

Abstract: The relationship between mechanical properties of epoxy resin-amine system and temperature has attracted extensive attention. In this paper, two crosslinking unit cells of DDM/DGEBA and DDS/DGEBA were established by using molecular dynamic (MD) simulation. On the basis of simulation analysis of glass transition temperature (T_g) obtained from density-temperature curves, the elastic modulus from high temperature (420 K) to cryogenic temperature (100 K) of two systems were investigated by using MD simulation and experimental methods. Furthermore, the relationship between modulus and a serious of microstructure, i.e. cohesive energy density (CED) and free volume of epoxy resin-amine system on the change of elastic modulus were investigated. Both MD results and experimental results showed that the elastic modulus of two epoxy resin systems increased as the temperature decreasing, which was attributed to the decrease of CED as well as the increase of free volume fraction as temperature decreasing.

Key words: epoxy resin, molecular simulation, high-low temperature elastic modulus, microstructure

CLC Number:

TB332

LI Hao, ZHANG Qing-jie, GAO Liang, ZHANG Wen-qing. MOLECULAR SIMULATION AND EXPERIMENTAL ANALYSIS ON ELASTIC MODULUS OF EPOXY RESIN AT HIGH-LOW TEMPERATURE[J]. Fiber Reinforced Plastics/Composites, 2016, 0(8): 33-37.

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