THERMAL RESIDUAL STRESS ANALYSIS OF BONDED COMPOSITE REPAIRSTO CRACKED METALLIC PLATE

Abstract

Abstract: The thermal residual stress will increase the stress intensity factor (SIF) of the crack after repair, which may subsequently enhance fatigue crack growth rate, and decrease the fatigue life of repaired structure. In this study, a 3-D finite element method is used to analyse the thermal residual stress of bonded composite repairs to cracked metallic plate and the SIF at the crack front of the repaired structure is computed using the virtual crack closure technique (VCCT). Meanwhile, the SIF at the crack tip is chosen as fracture criterion in order to estimate the influence of composite lay-up direction, curing temperature, and adhesive property to thermal residual stress of repaired structure. The obtained results show that the lay-up direction of [0°/45°/-45°/90°]_s could effectively decrease the thermal SIF. Meanwhile, the variation of the thermal SIF is approximately linear when curing temperature increases. The material property and thickness of adhesive do not show significant influence on the variation of the thermal SIF.

Key words: bonded composite repair, thermal residual stress, curing temperature, adhesive layer, finite element analysis (FEA)

CLC Number:

TB332

NIU Yong, MU Zhi-tao, LI Xu-dong, HAO Jian-bin. THERMAL RESIDUAL STRESS ANALYSIS OF BONDED COMPOSITE REPAIRSTO CRACKED METALLIC PLATE[J]. Fiber Reinforced Plastics/Composites, 2016, 0(5): 23-29.

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