Study on interfacial compatibility between AC531 resin and adhesive film

doi:10.19936/j.cnki.2096-8000.20231128.005

Abstract

Abstract: In this paper, J-116B adhesive and J-375 adhesive were used to prepare adhesive samples by co-curing molding method, and the adhesive samples were subjected to wet heat accelerated aging. The tensile and shear properties of the samples before and after aging were tested, and the reasons for the difference in properties and the mechanism of interface failure were analyzed. The results show that the interfacial compatibility between AC531 resin and J-375 adhesive is better than that between AC531 resin and J-116B adhesive. This is because the AC531 resin and the J-375 adhesive have a higher degree of overlap in the curing reaction process window, and the apparent activation energies of the two are closer.

Key words: interface compatibility, co-curing, damp heat aging, reaction thermodynamics, composites

CLC Number:

TB332

ZHAI Quansheng, MIAO Chunhui, CUI Haichao, ZHANG Chenqian, ZHAO Yanwen, YE Hongjun. Study on interfacial compatibility between AC531 resin and adhesive film[J]. COMPOSITES SCIENCE AND ENGINEERING, 2023, 0(11): 37-43.

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