COMPOSITES SCIENCE AND ENGINEERING ›› 2021, Vol. 0 ›› Issue (9): 12-17.DOI: 10.19936/j.cnki.2096-8000.20210928.002

• BASIC STUDY • Previous Articles     Next Articles

Analysis of temperature field for thermoplastic composites based on hot gas heating in an in-situ consolidation process

SUN Shi-yong, DONG Chen-hua, LIU Guan-san, YANG Rui*   

  1. School of Mechanical Engineering, Dalian University of Technology, Dalian 116024, China
  • Received:2021-02-25 Online:2021-09-28 Published:2021-10-13

Abstract: During the automated fiber placement and in-situ consolidation process of thermoplastic composites, the temperature history has a great influence on the final quality and performance of composites. Taking the temperature field during the laying process of the carbon fiber reinforced peek as the research object, a two-dimensional transient heat transfer model of the temperature field was established, the boundary conditions were established by dividing the model. The influence of the hot gas temperature, laying speed and the initial temperature of the mold on the temperature field of the layers was analyzed. Through the principle laying experiment, the temperature field measurement system was established, which verified the correctness of the finite element model. The results show that with the increase of the hot gas temperature and the decrease of the laying speed, the peak temperature of each layer gradually increases. When the initial temperature of the mold is room temperature, in order to meet the molding requirements, the hot gas temperature is 650 ℃ and the maximum laying speed is 6 mm/s. The initial temperature of the mold has a great influence on the temperature field of the first layer. In order to improve the bonding and melting effect of the first layer, increase the laying efficiency and reduce the overall temperature gradient, the mold temperature and the laying speed should be appropriately increased, and the hot gas temperature should be reduced.

Key words: thermoplastic composites, in-situ consolidation, temperature field, transient heat transfer model

CLC Number: