MODELING THE CURING KINETICS OF FM94 ADHESIVE BASED ON MF/MALEK METHOD

Fiber Reinforced Plastics/Composites ›› 2019, Vol. 0 ›› Issue (12): 72-76.

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MODELING THE CURING KINETICS OF FM94 ADHESIVE BASED ON MF/MALEK METHOD

PEI Shi-kai¹, LI Yi-bo^1,2*, YANG Yuan-cheng³, LI Jian¹

1.College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China;
2.State Key Laboratory of High Performance and Complex Manufacturing, Central South University,Changsha 410083, China;
3.Light Alloy Research Institute, Central South University, Changsha 410083, China

Received:2019-03-06 Online:2019-12-28 Published:2019-12-28

Abstract

Abstract: The curing kinetics of epoxy resin FM94 adhesive was studied by differential scanning calorimetry (DSC) at different heating rates. The activation energies of the curing reaction were calculated based on Model-Free method by analyzing DSC curves at different heating rates, and the curing mechanism of FM94 adhesive was explained. The most probable curing mechanism function was determined by Malek method. The results indicated that the two-parameter (m, n) autocatalytic model can well describe the curing reaction process of FM94 adhesive. The fractional conversion of DSC curves obtained using the experimental data showed a good agreement with the curves calculated theoretically under 2 K/min~10 K/min heating rates.

Key words: dynamic DSC, FM94 adhesive, curing mechanism, Model-Free method, Malek method

CLC Number:

TB332

PEI Shi-kai, LI Yi-bo, YANG Yuan-cheng, LI Jian. MODELING THE CURING KINETICS OF FM94 ADHESIVE BASED ON MF/MALEK METHOD[J]. Fiber Reinforced Plastics/Composites, 2019, 0(12): 72-76.

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MODELING THE CURING KINETICS OF FM94 ADHESIVE BASED ON MF/MALEK METHOD

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