STUDY OF THE EFFECTS OF PROCESSING CONDITIONS ON VOID DEFECT IN CARBON FIBER/EPOXY COMPOSITES

Abstract

Abstract: A experimental simulation system for composites in hot pressing process was established for studying void formation evolution. By means of this system, the effects of molding pressure, pressure applying moment, bleeding mode and sample thickness on void were investigated. The results indicate that the simulation system can be used to obtain the relationship between void and processing factors. For MT300/603 carbon fiber/epoxy prepreg, increasing molding pressure and decreasing pressure applying temperature can reduce porosity and void size, and the molding pressure is more obvious for eliminating void. Moreover, resin flow plays an important role in void elimination mechanism rather than pressure squashing and venting effects. Thickness of prepreg stack has significant effect on void formation. These results provide important studying method and experimental evidences for void defect control in composites for hot pressing process.

Key words: composites, hot pressing process, prepreg, void

CLC Number:

TB332

CHEN Chao, ZHANG Ya-ting, GU Yi-zhuo, ZHANG Hua-ting. STUDY OF THE EFFECTS OF PROCESSING CONDITIONS ON VOID DEFECT IN CARBON FIBER/EPOXY COMPOSITES[J]. COMPOSITES SCIENCE AND ENGINEERING, 2014, 0(5): 51-55.

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