STUDY ON THE EPOXY RESIN AND CURING SYSTEM OF MID-TEMPERATURE PREPREG

Abstract

Abstract: This paper studies an epoxy system which could be cured at mid-temperature and is suitable for the preparation of hot-melt method, focusing on the technological properties, storage performance of the resin system and discussing the curing mechanism of dicyandiamide/epoxy resin according to DSC and IR. The results show that when the ratio of dicyandiamide and substituted urea is 6∶3, the prepreg can be achieved with an epoxy resin cured at mid-temperature and at room temperature, and it will obtain a longer shelf life.

Key words: hot-melt film method, prepreg, cure at mid-temperature, epoxy resin

CLC Number:

TB332

YANG Si-hui, WANG Xiang, WANG Jun. STUDY ON THE EPOXY RESIN AND CURING SYSTEM OF MID-TEMPERATURE PREPREG[J]. COMPOSITES SCIENCE AND ENGINEERING, 2015, 0(7): 73-77.

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