COMPOSITES SCIENCE AND ENGINEERING ›› 2015, Vol. 0 ›› Issue (3): 26-30.

• BASIC STUDY • Previous Articles     Next Articles

STUDY ON MODIFIED IMIDAZOLE/EPOXY CURING SYSTEM

LIU Tu-yuan1, WANG Jun1*, SHEN Hui2, HU Yan-zhi2   

  1. 1. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China;
    2. Shanghai Composite Materials Technology Company, Shanghai 201100, China
  • Received:2015-01-04 Online:2015-03-28 Published:2021-09-13

Abstract: In this paper, the curing reaction kinetics equation of modified imidazole/epoxy was studied through the DSC to get a view of the influnence of the differernt content of modified imidazole on the Tg of the resin with DSC and DMA. At the same time, the reaction mechanism was studied by infrared analysis. The results showed that the Ea of modified imidazole/epoxy resin system is 60.21kJ/mol and frequency factor A is 2.459 ×107s-1; the Tg of the modified imidazole/epoxy increased with the increase of modified imidazole first, then reduce with it. The maximum is 163.3℃ when the content is 4%. Modified imidazole deblock and isocyanate react with the hydroxyl groups during the curing process.

Key words: modified imidazole, epoxy, kinetics, glass transition temperature, deblocking

CLC Number: