COMPOSITES SCIENCE AND ENGINEERING ›› 2021, Vol. 0 ›› Issue (5): 80-85.DOI: 10.19936/j.cnki.2096-8000.20210528.012

• APPLICATION RESEARCH • Previous Articles     Next Articles

CURING KINETICS AND ISOTHERMAL TRANSFORMATION (TTT) DIAGRAM OF Z616 PHENOLIC RESIN

ZHAO Zhi-ying1,2, TIAN Mou-feng2*, SONG Jin-mei2, XU Ya-feng2   

  1. 1. School of Materials Science & Engineering, Beijing Institute of Technology, Beijing 100081, China;
    2. Beijing Composite Materials Co., Ltd., Beijing 102101, China
  • Received:2020-06-28 Online:2021-05-28 Published:2021-08-04

Abstract: Z616 phenolic resin is an ablative resin system, which aimed to be used for hot melt prepreg curing at high temperature. In this paper, utilizing Kissinger equation and Crane equation, the cure kinetics of the phenolic resin system was studied by DSC. The parameters of resin curing reaction were obtained by origin fitting analysis, which gave 77.235 kJ/g for the activation energy, 1.92×108 for the constant factor and 0.9088 as the reaction order. Furthermore, DSC tests were performed on resins with different holding times at a constant temperature to obtain the glass transition temperature and curing degree. DiBenedetto empirical equation is used to establish the relationship model between glass transition temperature and curing degree. Moreover, the gelation process of Z616 phenolic resin was investigated by Haake Mars RS6000 Rotational Rheometer, and the relationship between gel-time and temperature was obtained. The degree of curing at the time of gelation is 0.08, and the glass transition temperature is 89.1 ℃. Finally, the equivalent curing degree, glass temperature transition and gelation were plotted versus time, and the temperature-time-transition (TTT) diagram was formed for the Z616 phenolic resin system. From this TTT diagram, the state of the resin system could be known at any temperature for any time. The forming parameters of Z616 phenolic resin-based composites under the hot-pressing process can be reasonably set.

Key words: phenolic resin, cure kinetics, TTT diagram, composites

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