CURING MECHANISM OF PHENOLIC RESIN MODIFIED BY PHENYLPHENOL BASED ON VARIABLE TEMPERATURE FTIR SPECTRA

doi:10.19936/j.cnki.2096-8000.20210528.005

Abstract

Abstract: To solve the problem that the curing mechanism of phenylphenol modified phenolic resin remained unclear, the characteristic structure hydroxymethyl, different substituent methylene, and ether bond were investigated by variable temperature FT-IR. The gas products released with the increase of curing temperature were characterized by Thermogravimetry-Mass Spectrometry. The curing mechanism from 90 ℃ to 230 ℃ was concluded finally. The results showed that the main reaction was the formation of the p-p methylene group in the range of 90 ℃~120 ℃. It is difficult to form the o-p methylene bridge at this stage. In the range of 120 ℃~170 ℃, the main reaction is the formation of the p-p methylene group. From 170 ℃ to 200 ℃, the main reactions are the breaking of the ether bond, the formation of the carbonyl group, and the formation of the propyl bridge. Above 200 ℃, the main reactions could be polycondensation reaction among phenolic hydroxyl groups, and the formation reaction of carbonyl groups. The ether bond breaks completely above 230 ℃. This work provides a new method to study the curing mechanism of phenolic resin. It is a benefit for the rational design of the curing process of phenolic resin.

Key words: phenolic resin, curing mechanism, variable temperature FT-IR, thermogravimetry-mass spectrometry, composites

CLC Number:

TB332

ZHANG Ying, HU Hong-lin, WANG Zai-duo, LIU Liang, YU Rui-lian. CURING MECHANISM OF PHENOLIC RESIN MODIFIED BY PHENYLPHENOL BASED ON VARIABLE TEMPERATURE FTIR SPECTRA[J]. COMPOSITES SCIENCE AND ENGINEERING, 2021, 0(5): 37-42.

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