Investigation on the cure kinetics model of epoxy resin filled with hollow glass microspheres
SHU Liwei, ZHANG Ying, GAO Jincheng, HU Xueqin, DING Anxin
COMPOSITES SCIENCE AND ENGINEERING . 2026, (8): 70 -78 .  DOI: 10.19936/j.cnki.2096-8000.20260828.009

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