Investigation on compression modulus of epoxy resin syntactic foam filled with hollow glass microspheres
WANG Yexuan, GAO Shuang, GAO Jincheng, YANG Fan, DING Anxin
COMPOSITES SCIENCE AND ENGINEERING . 2025, (7): 33 -40 .  DOI: 10.19936/j.cnki.2096-8000.20250728.005

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