Synthesis and application of silicone modified thermosetting phenolic resin

doi:10.19936/j.cnki.2096-8000.20260228.008

Abstract

Abstract: In this paper, 3-isocyanatopropyl triethoxysilane (KH-907) was employed as a modifier, while phenol and formaldehyde served as monomer raw materials. The intermediate of N-(3-triethoxysilylpropyl) phenyl carbamate was synthesized by controlling the conditions of the addition reaction. Subsequently, this intermediate reacted with formaldehyde under the catalysis of an alkaline catalyst, successfully synthesizing the organosilicon-modified phenolic resin liquid (IPTES-PF). The chemical structure and curing behavior of the modified phenol-formaldehyde (PF) were investigated via fourier transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects of the addition amount of organosilicon and the material ratio on the mechanical properties and thermal stability of the modified PF were studied through mechanical property tests and thermogravimetric (TG) analysis. The results indicated that the introduction of KH-907 enhanced the heat resistance of PF. Moreover, as the content of the modifier KH-907 and the molar ratio of formaldehyde increased, the mechanical properties of the organosilicon-modified PF initially rose and then declined. When the content of KH-907 was 15% and the molar ratio of phenol to formaldehyde was 1∶1.8, the mechanical properties of the organosilicon-modified PF resin liquid were optimal, with a tensile shear strength of 7.06 MPa and a peel strength of 328 N/5 cm. The impact strength of the silicone modified PF composite and the grinding ratio of the consolidated abrasive tool reach the maximum when the content of KH-907 is 15%, which are 2.87 kJ/m² and 20.913, respectively.

Key words: phenolic resin, thermosetting, silicone modification, heat resistance, mechanical property, composites

CLC Number:

TB332

ZHAO Congcong, FENG Jiajia, AN Kunhua, LI Xuexue, LIU Cong, ZHANG Linqi. Synthesis and application of silicone modified thermosetting phenolic resin[J]. COMPOSITES SCIENCE AND ENGINEERING, 2026, 0(2): 58-64.

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