复合材料科学与工程 ›› 2024, Vol. 0 ›› Issue (12): 43-48.DOI: 10.19936/j.cnki.2096-8000.20241228.006

• 基础研究 • 上一篇    下一篇

联苯型环氧树脂强韧化TDE-85树脂体系的制备与性能

侯镇弘1, 陆奇2, 赵星诺1, 徐锦文1, 夏宏伟3, 张颂3, 侯锐钢1, 周权1*   

  1. 1.华东理工大学 材料科学与工程学院 特种功能高分子材料及相关技术教育部重点实验室,上海 200237;
    2.浙江晨诺高分子材料有限公司,嘉兴 314204;
    3.无锡新宏泰电器科技股份有限公司, 无锡 214174
  • 收稿日期:2024-04-18 出版日期:2024-12-28 发布日期:2025-01-14
  • 通讯作者: 周权(1973—),男,博士,教授,博士生导师,研究方向为高性能基体树脂及其复合材料,qzhou@ecust.edu.cn。
  • 作者简介:侯镇弘(1999—),男,硕士,研究方向为环氧树脂的改性。
  • 基金资助:
    中央高校基本科研业务费专项资金(JKD01231701)

Preparation and properties of TDE-85 resin system strengthened and toughened by biphenyl epoxy resin

HOU Zhenhong1, LU Qi2, ZHAO Xingnuo1, XU Jinwen1, XIA Hongwei3, ZHANG Song3, HOU Ruigang1, ZHOU Quan1*   

  1. 1. Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Material Science and Engineering, Shanghai 200237, China;
    2. Zhejiang Chennuo Polymer Materials Co., Ltd., Jiaxing 314204, China;
    3. Wuxi New Hongtai Electrical Technology Co., Ltd., Wuxi 214174, China
  • Received:2024-04-18 Online:2024-12-28 Published:2025-01-14

摘要: 环氧树脂因其黏结力强、热稳定性好等优点,被广泛应用于涂料、电子封装材料和胶黏剂等领域,但其高交联密度也带来了脆性大、韧性差的问题,成为制约其发展应用的主要因素。采用熔融共混的方法,以3,3′-二氨基二苯砜(3,3′-DDS)为固化剂,用联苯型环氧树脂3,3′,5,5′-四甲基联苯双酚二缩水甘油醚(TMBP)改性高性能环氧树脂(TDE-85)。研究了改性树脂体系的力学性能,偏光显微镜和扫描电子显微镜的分析表明液晶结构能良好分散在环氧树脂基体中并增强增韧。结果表明:当TMBP含量为6wt%时,固化物的力学性能明显提高,冲击强度和弯曲强度分别提高了30%和27%,韧性和强度明显提升;当TMBP含量为4wt%时,拉伸强度和拉伸模量均达到最大,分别为93.69 MPa与5.39 GPa。

关键词: 环氧树脂, 热性能, 力学性能, 共混改性, 液晶结构, 复合材料

Abstract: Epoxy resin is widely used in coatings, electronic packaging materials and adhesives because of its strong adhesive strength and good thermal stability, but its high cross-linking density also brings the problem of brittleness and poor toughness, which has become the main factor restricting its development and application. A high performance epoxy resin (TDE-85) was modified by biphenyl epoxy resin 3,3′,5,5′ -tetramethylbiphenyl bisphenol diglycidyl ether (TMBP) with 3,3′ -diaminodiphenyl sulfone (3,3′-DDS) as curing agent by melt blending method. The mechanical properties of the modified resin system were studied. The results of polarizing microscope and SEM showed that the liquid crystal structure could be well dispersed in the epoxy resin matrix and strengthened and toughened. The results show that when the TMBP content is 6wt%, the mechanical properties of the cured material are obviously improved, the impact strength and flexural strength are increased by 30% and 27% respectively, and the strength and toughness is obviously improved. When the TMBP content is 4wt%, the tensile strength and tensile modulus reach the maximum of 93.69 MPa and 5.39 GPa.

Key words: epoxy resin, thermal properties, mechanical properties, blending modification, liquid crystal structure, composites

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